1 Ocak 2018 Konferans bildirisi Açık Erişim

Memioglu, Onur; Karakuzulu, Alper; Gundel, Adnan; Kocer, Fatih; Civi, Ozlem Aydin

Dublin Core

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  <dc:creator>Memioglu, Onur</dc:creator>
  <dc:creator>Karakuzulu, Alper</dc:creator>
  <dc:creator>Gundel, Adnan</dc:creator>
  <dc:creator>Kocer, Fatih</dc:creator>
  <dc:creator>Civi, Ozlem Aydin</dc:creator>
  <dc:date>2018-01-01</dc:date>
  <dc:description>This paper describes the design and verification results of two wideband class AB High Power Amplifiers (PA), encapsulated in commercial packages. Both amplifiers designed on WIN Semiconductors' 0.25 mu m GaN on SiC technology. The selected GaN process features compact common-source (CS) transistor layouts with individual source grounding vias. The family spans the whole X-band frequency with the first design tuned between 7-11 GHz and the second design tuned between 10-12 GHz. Both designs have saturated power output greater than 25 W throughout the whole bandwidth with peak power added efficiency at 30%. A multistage power combining matching strategy to achieve a tradeoff in wideband performance and power output is given. In depth discussion of the MMIC design of the PAs is supported by a discussion of the thermal management of the packages, including the PCB design and active cooling methodology, in order to present a fully functional PA family.</dc:description>
  <dc:identifier>https://aperta.ulakbim.gov.trrecord/33311</dc:identifier>
  <dc:identifier>oai:zenodo.org:33311</dc:identifier>
  <dc:rights>info:eu-repo/semantics/openAccess</dc:rights>
  <dc:rights>http://www.opendefinition.org/licenses/cc-by</dc:rights>
  <dc:title>Design and Implementation of an Encapsulated GaN X-band Power Amplifier Family</dc:title>
  <dc:type>info:eu-repo/semantics/conferencePaper</dc:type>
  <dc:type>publication-conferencepaper</dc:type>
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