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Memioglu, Onur; Karakuzulu, Alper; Gundel, Adnan; Kocer, Fatih; Civi, Ozlem Aydin
{
"URL": "https://aperta.ulakbim.gov.tr/record/33311",
"abstract": "This paper describes the design and verification results of two wideband class AB High Power Amplifiers (PA), encapsulated in commercial packages. Both amplifiers designed on WIN Semiconductors' 0.25 mu m GaN on SiC technology. The selected GaN process features compact common-source (CS) transistor layouts with individual source grounding vias. The family spans the whole X-band frequency with the first design tuned between 7-11 GHz and the second design tuned between 10-12 GHz. Both designs have saturated power output greater than 25 W throughout the whole bandwidth with peak power added efficiency at 30%. A multistage power combining matching strategy to achieve a tradeoff in wideband performance and power output is given. In depth discussion of the MMIC design of the PAs is supported by a discussion of the thermal management of the packages, including the PCB design and active cooling methodology, in order to present a fully functional PA family.",
"author": [
{
"family": "Memioglu",
"given": " Onur"
},
{
"family": "Karakuzulu",
"given": " Alper"
},
{
"family": "Gundel",
"given": " Adnan"
},
{
"family": "Kocer",
"given": " Fatih"
},
{
"family": "Civi",
"given": " Ozlem Aydin"
}
],
"id": "33311",
"issued": {
"date-parts": [
[
2018,
1,
1
]
]
},
"title": "Design and Implementation of an Encapsulated GaN X-band Power Amplifier Family",
"type": "paper-conference"
}
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