Dergi makalesi Açık Erişim
Rouhi, Sina; Ozdemir, Mehtap; Ekmekcioglu, Merve; Yigen, Serap; Demirhan, Yasemin; Szerling, Anna; Kosiel, Kamil; Kozubal, Maciej; Kruszka, Renata; Prokaryn, Piotr; Ertugrul, Mehmet; Reno, John L.; Aygun, Gulnur; Ozyuzer, Lutfi
@article{rouhi_sina_2021_239438, author = {Rouhi, Sina and Ozdemir, Mehtap and Ekmekcioglu, Merve and Yigen, Serap and Demirhan, Yasemin and Szerling, Anna and Kosiel, Kamil and Kozubal, Maciej and Kruszka, Renata and Prokaryn, Piotr and Ertugrul, Mehmet and Reno, John L. and Aygun, Gulnur and Ozyuzer, Lutfi}, title = {{In-situ thin film copper-copper thermocompression bonding for quantum cascade lasers}}, journal = {{JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS}}, year = 2021, volume = 32, number = 11, pages = {15605-15614}, month = jan, }
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