1 Ocak 2021 Dergi makalesi Açık Erişim

Rouhi, Sina; Ozdemir, Mehtap; Ekmekcioglu, Merve; Yigen, Serap; Demirhan, Yasemin; Szerling, Anna; Kosiel, Kamil; Kozubal, Maciej; Kruszka, Renata; Prokaryn, Piotr; Ertugrul, Mehmet; Reno, John L.; Aygun, Gulnur; Ozyuzer, Lutfi

BibTeX

@article{rouhi_sina_2021_239438,
  author       = {Rouhi, Sina and
                  Ozdemir, Mehtap and
                  Ekmekcioglu, Merve and
                  Yigen, Serap and
                  Demirhan, Yasemin and
                  Szerling, Anna and
                  Kosiel, Kamil and
                  Kozubal, Maciej and
                  Kruszka, Renata and
                  Prokaryn, Piotr and
                  Ertugrul, Mehmet and
                  Reno, John L. and
                  Aygun, Gulnur and
                  Ozyuzer, Lutfi},
  title        = {{In-situ thin film copper-copper thermocompression 
                   bonding for quantum cascade lasers}},
  journal      = {{JOURNAL OF MATERIALS SCIENCE-MATERIALS IN 
                   ELECTRONICS}},
  year         = 2021,
  volume       = 32,
  number       = 11,
  pages        = {15605-15614},
  month        = jan,
}