1 Ocak 2013 Konferans bildirisi Açık Erişim

Tavman, Ismail; Turgut, Alpaslan; Horny, Nicolas; Chirtoc, Mihai

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    <subfield code="a">Polymer composites with high thermal conductivity are used more frequently in thermal management of electronic packaging systems. In this study, conductive polymer composites were prepared by melt mixing of ethylene-vinyl acetate (EVA) copolymer with graphite at different volumetric concentrations up to 29.3%. Two kinds of graphite were used as reinforcement to prepare composites: untreated natural graphite (UG) having particle sizes ranging from 20 mu m to 25 mu m and expanded graphite (EG) having originally particle sizes ranging from 5 to 6 mu m in length. Upon mixing at high shear forces EG exfoliates in thin sheets of a few nanometers in thickness. Due to this high aspect ratio of graphite sheets, nanocomposites filled with expanded graphite have a lower percolation threshold for electrical conductivity, about (5 to 6) vol.% compared to the composites filled with untreated graphite (UG) which have a percolation threshold of (15 to 17) vol.%. Thermal diffusivity of the samples was measured by photothermal radiometry. At similar concentrations, thermal diffusivity values for the nanocomposites, EG-filled EVA, were significantly higher than those composites filled with UG.</subfield>
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    <subfield code="a">2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME)</subfield>
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    <subfield code="a">Tavman, Ismail</subfield>
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