Effects of Epoxy-POSS Nanoparticles on the Properties of PLA/TPU Blends

In this study, the influence of epoxy functionalized polyhedral oligomeric silsesquioxanes (G-POSS) loading level on the mechanical, thermal and rheological properties of poly(lactic acid) (PLA)/thermoplastic polyurethane (TPU) blends were investigated. The blends were prepared in an Xplore Instruments MC15 twin-screw microcompounder at 200 degrees C barrel temperature and 100 rpm screw speed. Mechanical properties were characterized by tensile and impact tests, thermal properties were determined via differential scanning calorimeter (DSC) and thennogravimetric analysis (TGA). Rheological properties were examined by oscillatory rheometer. A decreasing trend in tensile strength and thermal degradation temperature were obtained for PLA/TPU blends at high G-POSS loading levels. 0-POSS loading level did not exhibit significant effect on glass transition, crystallization and melting temperatures of the blends.