Published January 1, 2010
| Version v1
Journal article
Open
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
- 1. Erciyes Univ, Inst Sci & Technol, Dept Phys, TR-38039 Kayseri, Turkey
- 2. Erciyes Univ, Fac Arts & Sci, Dept Phys, TR-38039 Kayseri, Turkey
- 3. Nigde Univ, Fac Arts & Sci, Dept Phys, Nigde, Turkey
- 4. Erciyes Univ, Fac Educ, Dept Sci Educ, TR-38039 Kayseri, Turkey
Description
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.
Files
bib-dba784f0-a938-45aa-8c32-d2c29955b171.txt
Files
(216 Bytes)
| Name | Size | Download all |
|---|---|---|
|
md5:cc4d052fbdb4fef15f569467a7db6625
|
216 Bytes | Preview Download |