Yayınlanmış 1 Ocak 2010
| Sürüm v1
Dergi makalesi
Açık
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
- 1. Erciyes Univ, Inst Sci & Technol, Dept Phys, TR-38039 Kayseri, Turkey
- 2. Erciyes Univ, Fac Arts & Sci, Dept Phys, TR-38039 Kayseri, Turkey
- 3. Nigde Univ, Fac Arts & Sci, Dept Phys, Nigde, Turkey
- 4. Erciyes Univ, Fac Educ, Dept Sci Educ, TR-38039 Kayseri, Turkey
Açıklama
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.
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