Published January 1, 2024 | Version v1
Journal article Open

Investigation of magneto-convection characteristics in a sudden expanding channel with convex surface geometry under thermally developing flow conditions

  • 1. Univ Stuttgart, Inst Aerosp Thermodynam, Stuttgart, Germany
  • 2. Kastamonu Univ, Fac Engn, Dept Mech Engn, Kastamonu, Turkiye
  • 3. Ankara Yildirim Beyazit Univ, Fac Engn, Dept Mech Engn, Ankara, Turkiye

Description

PurposeThe purpose of this study is to analyse the magnetic field effect on Fe3O4/H2O Ferrofluid flowing in a sudden expansion tube, which has specific behaviour in terms of rheology, with convex dimple fins. Because the investigation of flow separation is a prominent application in performance, the effect of magnetic field and convex dimple on the thermo-hydraulic performance of sudden expansion tube are examined, in detail.Design/methodology/approachDuring the solution of the boundary conditions of the sudden expansion tube, finite volume method was used. Analyses have been conducted considering the single-phase solution, steady-state, incompressible fluid and no-slip condition of the wall under forced convection conditions. In the analyses, it has been assumed that the flow was developing thermally and has been fully developed hydrodynamically.FindingsThe present study focuses on exploring the influence of the magnetic field, nanofluid concentration and convex dimple fins on the thermo-hydraulic performance of sudden expansion tube. The results indicate that the strength of the magnetic field, nanofluid concentration and convex dimple fins have a positive effect on the convective heat transfer in the system.Originality/valueThe authors conducted numerical studies, determining through a literature search that no one had yet investigated enhancing heat transfer on a sudden expansion tube using combinations of magnetic fields, nanofluids and convex dimple fins. The results of the numerical analyses provide valuable information about the improvement of heat transfer and system performance in electronic device cooling and heat exchangers.

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