Effect of substrate thickness and material on heat transfer in microchannel heat sinks

Heat and fluid flow in microchannels of size (200 mu m x 200 mu m, 5 cm long) of different substrate thicknesses (t = 100 mu m-1000 mu m) and different MEMS (Microelectromechanical Systems) materials (Polyimide, Silica Glass, Quartz, Steel, Silicon, Copper) was studied to observe the effects of thermal conductivity and substrate thickness on convective heat transfer in laminar internal flows.