An investigation of influencing of Sb and Bi contents on surface tensions associated with Pbfree Sn-Zn-Sb-Bi quaternary and sub-quaternary solder alloys

ABSTRACT
The surface tensions of ternary and quaternary systems of Snbased
Pb-free solder alloys have been calculated using
geometric models, such as Muggianu, Kohler, Chou’s
general solution model (GSM), Toop, Guggenheim, ideal
Butler and Butler models. It is observed from the calculation
carried out in the present work that Sb and Bi contents
decrease the surface tension of the solder alloys Sn-Zn-Sb-
Bi. It is inferred from the statistical analysis that the best
agreement between the experimental results and the
corresponding calculated values of the surface tensions is
generally observed in GSM and Muggianu models among
the geometric models. Whereas Muggianu model is the
most appropriate. Relatively good agreements have been
observed between models considered in this study and
experimental data.