Published January 1, 2013
| Version v1
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SiGe Process Integrated On-Chip Dipole Antenna on Finite-Size Ground Plane
- 1. Sabanci Univ, Dept Elect Engn, TR-34956 Istanbul, Turkey
- 2. Technol Proc Integrat IHP GmbH, D-15236 Frankfurt, Germany
- 3. Karlsruhe Inst Technol, D-76131 Karlsruhe, Germany
Description
This letter investigates the effect of a finite-size ground plane on the radiation pattern and reflection coefficient of a SiGe process integrated on-chip antenna. A flat 77-GHz on-chip strip dipole antenna integrated with a lumped balun circuit is designed and implemented. For increased directivity, the etched silicon substrate is placed on a metal ground plate. The on-chip antenna with the balun circuit is connected to GSG pads for measurement purposes. The antenna is well matched at the original resonance frequency band with 7-12 GHz impedance bandwidth and 4 dBi measured gain at 85 GHz.
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